Tool mapping 90 companies in the photonics and CPO supply chain

3 days ago

Co-packaged optics (CPO) integrates optical components like lasers and modulators directly into the same package as switch ASICs or AI accelerators, enabling higher bandwidth per port (1.6T–6.4T) with lower power consumption.
CPO involves four package layers: InP laser die, hybrid bond interface, silicon photonics chiplet, and the switch ASIC or accelerator, connected through advanced packaging to minimize electrical trace losses.
Key supply-chain dependencies include SOITEC for SOI wafers, ASML for EUV lithography, Sumitomo Electric and IQE for InP wafers, EV Group for bonding, TSMC for packaging, and others for lasers, wafers, and gases.
CPO is replacing pluggable transceivers by eliminating long electrical traces, reducing power per bit by about half, and supporting the bandwidth needs of large-scale AI training fabrics, with commercial deployments starting from 2025 onward.

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