Nvidia to shift 2028 chip production to Intel, reshaping TSMC strategy
8 days ago
- #manufacturing
- #semiconductors
- #supply-chain
- TSMC's dominance in advanced chip processes and packaging makes it a key target under US manufacturing mandates.
- Nvidia and Apple plan to collaborate with Intel for the 2028 Feynman architecture, focusing on low-volume, non-core production.
- Nvidia's Feynman GPU will use TSMC for the die but may shift parts of the I/O die to Intel's 18A or 14A process.
- Intel's EMIB packaging will handle up to 25% of final packaging, with TSMC managing the rest.
- US chipmakers are exploring Intel partnerships due to political and supply chain pressures, but meaningful cooperation may start with 14A in 2028.
- Apple is discussing an entry-level M-series chip with Intel, marking a shift in their relationship post-Apple Silicon transition.
- TSMC sees order diversions to Intel as an opportunity to reduce monopoly concerns and political pressure while retaining high-end contracts.
- Other potential collaborators with Intel include Google, Microsoft, AWS, Qualcomm, Broadcom, AMD, and Tesla.
- TSMC's long-term advantage may be reinforced as customers experiment with alternatives and recognize its superior capabilities.