Thermal, Mechanical, and Material Stresses Grow with Die Stacking
11 days ago
- #3D-IC
- #Thermal Stress
- #Multi-die
- More analysis and data are needed to predict die interactions in multi-die packages.
- Thermal and mechanical stress management requires detailed knowledge of device usage, packaging, and stress points.
- Current GPUs run at 500 watts, potentially increasing to 1,000 watts/cm², complicating heat dissipation.
- Thermal modeling and management must be integrated in multi-die assemblies, unlike past separate approaches.
- Stress issues arise from manufacturing processes, causing delamination and connection losses.
- Electrical stress impacts timing and behavior, with new challenges from material differences and structural features.
- Stresses in multi-die systems are interdependent, affecting thermal and mechanical performance.
- Intensive modeling is required to simulate manufacturing processes and thermal cycling effects.
- Foundries now provide stress and warpage data, crucial for accurate simulations.
- Anisotropic thermal conduction adds complexity, requiring detailed modeling.
- Manufacturing and assembly processes introduce irreversible stresses, affecting structural integrity.
- Thermal stress impacts device properties, requiring new modeling approaches.
- 3D-IC designs complicate heat dissipation, necessitating electrothermal simulations.
- Thermal stress is a system-wide issue, affecting chips, packages, PCBs, and enclosures.
- Early thermal analysis is essential in 3D-IC design to avoid unreliability.
- Thermal-induced stress affects timing and power, requiring multi-phasic analysis.
- Data movement in 3D-ICs must avoid bottlenecks without overusing TSVs.
- Different dies heat at varying rates, impacting device properties differently.
- Mitigating stress involves advanced modeling, microfluidic cooling, and AI-driven tools.
- Multi-die assemblies are inevitable, with stress management becoming a core design consideration.