TSMC targets AI acceleration with A14 process and 'System on Wafer-X'
14 days ago
- #AI
- #manufacturing
- #semiconductor
- TSMC announces new chip manufacturing and packaging technologies for AI and high-performance computing.
- The A14 process node, launching in 2028, promises 15% better performance or 30% lower power consumption than N2.
- TSMC introduces System on Wafer-X (SoW-X), integrating compute dies, memory, and optical interconnects into a single package.
- SoW-X can combine at least 16 compute chips, delivering thousands of watts of power, surpassing current GPU setups.
- TSMC plans to expand in the US with two advanced packaging facilities near its Arizona chip fabs.
- The Arizona site will include six semiconductor plants, two packaging facilities, and an R&D center.
- Enterprises must evaluate manufacturing technologies, packaging solutions, and pricing when choosing a foundry partner.
- TSMC's broad ecosystem offers flexibility, while Intel provides tighter in-house support but fewer external options.
- Supply chain capacity, lead times, and yield performance are critical factors for enterprise buyers.