A CT scanner reveals surprises inside the 386 processor's ceramic package
15 days ago
- #Intel 386
- #Ceramic Package
- #Processor Design
- Intel released the 386 processor in 1985, the first 32-bit chip in the x86 line.
- The 386 processor was packaged in a ceramic square with 132 gold-plated pins.
- A 3-D CT scan revealed six layers of complex wiring inside the ceramic package.
- The 386 has two separate power and ground networks: one for I/O and one for the CPU's logic.
- Intel designed a custom package with 'single-row double shelf bonding' to meet power requirements.
- The ceramic package is manufactured through a complex process involving ceramic green sheets and tungsten paste.
- The 386 has eight 'No Connect' pins, which are not connected to the motherboard.
- Intel's early processors were limited by inferior packages, but the 386 marked a significant improvement.
- The main drawback of the ceramic package was its high cost, leading to the introduction of a low-cost plastic package.
- Modern processors use Ball Grid Arrays or Land Grid Arrays with thousands of contacts.