Liquid Cooling Exhibits
9 days ago
- #AI-hardware
- #liquid-cooling
- #datacenter
- Hot Chips conference features hardware architecture presentations and company stands showcasing developments, including liquid cooling components.
- Waterblocks use microjets for cooling, with designs targeting chip hotspots for efficient heat transfer.
- Alloy Enterprises and Jetcool displayed waterblocks with microjets, some optimized for specific chips like the MI350X and MI300 series.
- Jetcool's 'SmartLid' waterblock sends water directly to the die, bypassing cold plates for improved efficiency.
- Copper and aluminum are used in waterblocks, with tradeoffs in heat transfer efficiency, weight, and corrosion resistance.
- Enterprise solutions like Nvidia's GB200 and GB300 servers use liquid cooling for high-power AI chips, with some components air-cooled.
- AI-driven power demands are pushing datacenter cooling technologies, with racks drawing up to 180 kW or more.
- Liquid cooling innovations at Hot Chips 2025 focus on enterprise needs, but some techniques may benefit consumer hardware in the future.
- Harvesting waste heat for energy efficiency is a growing topic, though not highlighted in the article.