Apple A19 SoC die shot
5 hours ago
- #Apple A19
- #TSMC 3nm
- #iPhone 17
- First high-resolution microscopy images of Apple's A19 chip from iPhone 17.
- Built on TSMC’s third-generation 3 nm process node (N3P), improving over N3E used in A18.
- Higher transistor density, better energy efficiency, and modest performance gains.
- Hybrid CPU core design retained (performance + efficiency cores).
- GPU upgrades include more cores on Pro models.
- Enhancements in image signal processor, display engine, and Neural Engine for better AI, imaging, and power management.
- Die shots reveal physical layout: logic blocks, cache banks, interconnects.
- Reflects Apple's continuous advancements in process technology and architectural refinement.