OKI Develops 124-Layer PCB Technology
2 days ago
- OKI Circuit Technology developed a 124-layer PCB technology, a 15% increase over the conventional 108-layer design, for next-generation AI semiconductor testing equipment.
- The PCB is designed for wafer inspection equipment used with high bandwidth memory (HBM) like HBM, which requires high-density and high-frequency data transfer.
- Mass production technology is targeted for October 2025 at the Joetsu Plant in Niigata Prefecture, utilizing ultra-thin materials and a proprietary automatic transport system.
- The technology addresses the need for higher PCB density and layers due to increasing signal counts and chip miniaturization, while maintaining a thickness limit of 7.6 mm.
- OKI will showcase this technology at PCB East 2025 in Massachusetts, USA, from April 30 to May 2, 2025.