Samsung is expected to more than double output of its HBM4 and HBM4E DRAM
3 hours ago
- Samsung plans to more than double HBM4 family output next year, including HBM4 and HBM4E, with a 2.5-fold increase in glass carrier demand.
- Outsourced glass carrier cleaning volume will rise to 50,000 sheets per month in 2024 from 20,000 in 2023, up from 10,000 last year.
- Glass carriers prevent wafer bending during thinning and drilling, crucial for high-stack HBM production.
- HBM4 and HBM4E center on 12-layer and higher stacks, with output likely growing at least twofold due to increased glass carrier usage.
- Samsung started mass production of HBM4 in February and provided 12-layer HBM4E samples to Nvidia in May.
- Industry expects Samsung's HBM production scale to grow nearly 40% to ~250,000 wafers (monthly input) next year.
- HBM4 family share is projected to rise from ~40% this year to ~80% next year as HBM4E mass production ramps up.